Aries Electronics, Inc. / 24-3552-18

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Type	Description
Series	55
Package	Bulk
Part Status	Active
Type	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	24 (2 x 12)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Nickel Boron
Contact Finish Thickness - Mating	50.0µin (1.27µm)
Contact Material - Mating	Beryllium Nickel
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Nickel Boron
Contact Finish Thickness - Post	50.0µin (1.27µm)
Contact Material - Post	Beryllium Nickel
Housing Material	Polyetheretherketone (PEEK), Glass Filled
Operating Temperature	-55°C ~ 250°C

All the Eelctronics Components will be packing in very safely by ESD antistatic protection.

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