Preci-Dip / 550-10-356M26-001166

Image is for reference, please contact us to get the real picture

REMARK: Buy the 550-10-356M26-001166 Preci-Dip on xunyun-ic.com, we are Preci-Dip Corporation distributor,we sales new&original and offer 24 hours service,180 days warranty date, send the 550-10-356M26-001166 within 24 hours,please contact our sales team or send email to zimin@xinyunic.com Hope we can cooperate in the future.

Type	Description
Series	550
Package	Bulk
Part Status	Active
Type	BGA
Number of Positions or Pins (Grid)	356 (26 x 26)
Pitch - Mating	0.050" (1.27mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.050" (1.27mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	10.0µin (0.25µm)
Contact Material - Post	Brass
Housing Material	FR4 Epoxy Glass
Operating Temperature	-55°C ~ 125°C

All the Eelctronics Components will be packing in very safely by ESD antistatic protection.

package

BUYING OPTIONS

Stock Status: 4173

Minimum: 1

Call for price or sumbit a RFQ

Popular Models

	40-6556-30 Aries Electronics, Inc.
	523-13-173-16-005003 Mill-Max
	511-93-132-14-071003 Mill-Max
	116-91-628-41-001000 Mill-Max
	523-13-072-11-061003 Mill-Max
	22-4518-00 Aries Electronics, Inc.
	SIP050-1X09-157BLF Storage & Server IO (Amphenol ICC)
	110-88-314-41-530000 Mill-Max
	614-91-316-31-007000 Mill-Max
	DIP316-011BLF Storage & Server IO (Amphenol ICC)