Aries Electronics, Inc. / 30-0518-00

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Type	Description
Series	518
Package	Bulk
Part Status	Active
Type	SIP
Number of Positions or Pins (Grid)	30 (1 x 30)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Surface Mount
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	200.0µin (5.08µm)
Contact Material - Post	Brass
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature	-

All the Eelctronics Components will be packing in very safely by ESD antistatic protection.

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