Preci-Dip / 558-10-560M33-001104

Image is for reference, please contact us to get the real picture

REMARK: Buy the 558-10-560M33-001104 Preci-Dip on xunyun-ic.com, we are Preci-Dip Corporation distributor,we sales new&original and offer 24 hours service,180 days warranty date, send the 558-10-560M33-001104 within 24 hours,please contact our sales team or send email to zimin@xinyunic.com Hope we can cooperate in the future.

Type	Description
Series	558
Package	Bulk
Part Status	Active
Type	BGA
Number of Positions or Pins (Grid)	560 (33 x 33)
Pitch - Mating	0.050" (1.27mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Contact Material - Mating	Brass
Mounting Type	Surface Mount
Features	Closed Frame
Termination	Solder
Pitch - Post	0.050" (1.27mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	10.0µin (0.25µm)
Contact Material - Post	Brass
Housing Material	FR4 Epoxy Glass
Operating Temperature	-55°C ~ 125°C

All the Eelctronics Components will be packing in very safely by ESD antistatic protection.

package

BUYING OPTIONS

Stock Status: 4947

Minimum: 1

Call for price or sumbit a RFQ

Popular Models

	551-10-069-11-061005 Mill-Max
	SIP050-1X04-157BLF Storage & Server IO (Amphenol ICC)
	510-87-121-13-001101 Preci-Dip
	24-6503-20 Aries Electronics, Inc.
	614-13-084-10-031001 Mill-Max
	APA-628-G-C Samtec, Inc.
	540-44-084-17-400004 Mill-Max
	510-93-072-09-001002 Mill-Max
	8058-1G55 TE Connectivity Potter & Brumfield Relays
	114-93-432-41-117000 Mill-Max