Microsemi / M2S090S-1FG676I

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Type	Description
Series	SmartFusion®2
Package	Tray
Part Status	Obsolete
Architecture	MCU, FPGA
Core Processor	ARM® Cortex®-M3
Flash Size	512KB
RAM Size	64KB
Peripherals	DDR, PCIe, SERDES
Connectivity	CANbus, Ethernet, I²C, SPI, UART/USART, USB
Speed	166MHz
Primary Attributes	FPGA - 90K Logic Modules
Operating Temperature	-40°C ~ 100°C (TJ)
Package / Case	676-BGA
Supplier Device Package	676-FBGA (27x27)

All the Eelctronics Components will be packing in very safely by ESD antistatic protection.

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