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Manufacturer Part Number: | BDN13-3CB/A01 |
Manufacturer: | CTS Corporation |
Part of Description: | HEATSINK CPU W/ADHESIVE 1.31"SQ |
Lead Free Status / RoHS Status: | Lead Free / RoHS Compliant |
Stock Condition: | 5 In Stock |
Ship From: | Hong Kong |
Shipment Way: | DHL/Fedex/TNT/UPS/EMS |
Type | Description |
---|---|
Series | BDN |
Package | Box |
Part Status | Active |
Type | Top Mount |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method | Thermal Tape, Adhesive (Included) |
Shape | Square, Pin Fins |
Length | 1.310" (33.27mm) |
Width | 1.310" (33.27mm) |
Diameter | - |
Fin Height | 0.355" (9.02mm) |
Power Dissipation @ Temperature Rise | - |
Thermal Resistance @ Forced Air Flow | 6.00°C/W @ 400 LFM |
Thermal Resistance @ Natural | 16.10°C/W |
Material | Aluminum |
Material Finish | Black Anodized |