CTS Corporation / BDN13-3CB/A01

Manufacturer Part Number: BDN13-3CB/A01
Manufacturer: CTS Corporation
Part of Description: HEATSINK CPU W/ADHESIVE 1.31"SQ
Lead Free Status / RoHS Status: Lead Free / RoHS Compliant
Stock Condition: 5 In Stock
Ship From: Hong Kong
Shipment Way: DHL/Fedex/TNT/UPS/EMS
REMARK
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Specification

TypeDescription
SeriesBDN
PackageBox
Part StatusActive
TypeTop Mount
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodThermal Tape, Adhesive (Included)
ShapeSquare, Pin Fins
Length1.310" (33.27mm)
Width1.310" (33.27mm)
Diameter-
Fin Height0.355" (9.02mm)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow6.00°C/W @ 400 LFM
Thermal Resistance @ Natural16.10°C/W
MaterialAluminum
Material FinishBlack Anodized
All the Eelctronics Components will be packing in very safely by ESD antistatic protection.

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