CTS Corporation / BDN09-3CB

Manufacturer Part Number: BDN09-3CB
Manufacturer: CTS Corporation
Part of Description: HEATSINK CPU .91" SQ
Lead Free Status / RoHS Status: Lead Free / RoHS Compliant
Stock Condition: 1553 In Stock
Ship From: Hong Kong
Shipment Way: DHL/Fedex/TNT/UPS/EMS
REMARK
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Specification

TypeDescription
SeriesBDN
PackageBox
Part StatusActive
TypeTop Mount
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodThermal Tape, Adhesive (Not Included)
ShapeSquare, Pin Fins
Length0.910" (23.11mm)
Width0.910" (23.11mm)
Diameter-
Fin Height0.355" (9.02mm)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow9.60°C/W @ 400 LFM
Thermal Resistance @ Natural26.90°C/W
MaterialAluminum
Material FinishBlack Anodized
All the Eelctronics Components will be packing in very safely by ESD antistatic protection.

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