CTS Corporation / APF19-19-13CB

Manufacturer Part Number: APF19-19-13CB
Manufacturer: CTS Corporation
Part of Description: HEATSINK LOW-PROFILE FORGED
Lead Free Status / RoHS Status: Lead Free / RoHS Compliant
Stock Condition: 3703 In Stock
Ship From: Hong Kong
Shipment Way: DHL/Fedex/TNT/UPS/EMS
REMARK
Buy the APF19-19-13CB CTS Corporation on xunyun-ic.com, we are CTS Corporation Corporation distributor,we sales new&original and offer 24 hours service,180 days warranty date, send the APF19-19-13CB within 24 hours,please contact our sales team or send email to zimin@xinyunic.com Hope we can cooperate in the future.

Specification

TypeDescription
SeriesAPF
PackageBox
Part StatusActive
TypeTop Mount
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodThermal Tape, Adhesive (Not Included)
ShapeSquare, Fins
Length0.748" (19.00mm)
Width0.748" (19.00mm)
Diameter-
Fin Height0.500" (12.70mm)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow4.00°C/W @ 200 LFM
Thermal Resistance @ Natural-
MaterialAluminum
Material FinishBlack Anodized
All the Eelctronics Components will be packing in very safely by ESD antistatic protection.

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